Position of Senior Packaging Engineer for a publicly traded rapidly-growing fabless semiconductor company with proprietary solution in MEMS technology which integrates leading edge sensor technology with mixed signal processing circuitry onto a reliable, high quality, single chip using a standard CMOS IC process MUST HAVE EXTENSIVE EXPERIENCE WITH WAFER LEVEL PACKAGING IN A HIGH VOLUMN MANUFACTURING ENVIRONMENT.
The Company’s technology is ideally suited for a broad range of high-volume consumer electronics, biomedical, aerospace and automotive applications.
Their culture of innovation rewards passion, brainpower, and risk taking with industry-leading company stock options, benefits and competitive salaries, which provides a fantastic opportunity
This is both a technical leadership and management role. In order to effectively drive the overall design, you must be a proficient people manager, with an understanding of Asian culture and be able to effectively manage locations within the US and in Asia.
Location: US and China
Compensation: based on experience, full benefits, stock and bonus
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Please, no phone calls about this job!
Please do not contact job poster about other services, products or commercial interests.
